| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for connecting electronic parts to each other without using a resin adhesive in a technique for connecting between the electronic parts represented by an IC chip, and to provide a packaged printed circuit board utilizing the connecting technique. <P>SOLUTION: A method of connecting between electronic parts includes the steps of interposing a conductive substance-containing glass material 3 between electronic parts 1 and 2 arranged back-to-back, adhering the glass material to the back surfaces of the electronic parts by anode connecting, and fixing (connecting) the electronic parts to each other. Further, in the packaging printed circuit board in which the electronic parts are packaged, the conductive substance-containing glass material 3 is interposed between the electronic parts 1, 2 arranged back-to-back, the glass material is adhered to the back surface of the electronic parts by anode connecting, and the electronic parts are fixed (connected) to each other. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
