| 摘要 |
PROBLEM TO BE SOLVED: To make performable taping even when an inner lead is short. SOLUTION: In a lead frame, in which the inner leads of a plurality of leads arranged along the respective sides of a sealing body forming area whose plane shape is almost a square or a rectangle are connected to an insulating tape or a semiconductor device using the lead frame, the width of the tape connected to the inner lead of the lead positioned at the center of each of the sides of the sealing body formation area is set so as to be made narrower than the width of the tape connected to the inner lead of the lead positioned at the edge of each side. Also, when the plurality of leads are arranged along the respective sides of the sealing body whose plane shape is almost rectangular, the width of the tape connected to the inner lead of the lead positioned at the long side of the sealing body is set so as to be made narrower than the width of the tape connected to the inner lead of the lead positioned at the short side of the sealing body. Thus, it becomes possible to carry out taping even in a semiconductor device where the size of a sealing body is small. COPYRIGHT: (C)2004,JPO&NCIPI |
