发明名称 PRESSURE-BONDED PAPER LEAF MANUFACTURING APPARATUS FOR CUT PAPER
摘要 PROBLEM TO BE SOLVED: To provide a pressure-bonded paper leaves manufacturing apparatus for cut paper whose whole manufacturing apparatus is simple and small. SOLUTION: The pressure-bonded paper leaves manufacturing apparatus is equipped with a paper leaves carrying means 11 carrying the paper leaves P and folding them to half on the way of carrying, provided with an upper roller 18 carrying upper side paper leaves Pa and a lower roller 19 carrying lower side paper leaves Pb, and carrying the lower side paper leaves Pb precedingly to the upper side paper leaves Pa by temporally stopping the driving of the upper roller 18; a pressure-bonding film insertion means 21 comprising a metal plate 22 mounting two layers of the pressure-bonding film, a metal plate drive means 25 moving the metal plate 22 downward by magnetic force, pressing the lower side paper leaves Pb downward and forming a space between the upper and lower side paper leaves Pa and Pb to insert the metal plate 22 and the pressure-bonding film F in between; and a metal plate drawing means 31 for drawing out only the metal plate 22 from the paper leaves P with inserted metal plate 22 and the pressure-bonding film F. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004223991(A) 申请公布日期 2004.08.12
申请号 JP20030017534 申请日期 2003.01.27
申请人 JDL ENGINEERING KK 发明人 MORISHITA EISAKU
分类号 B31B1/26;B31B1/08;B31B1/20;B31B1/64;(IPC1-7):B31B1/26 主分类号 B31B1/26
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