| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device with high emission intensity (efficiency of light extracted to outside) and less color slippage. <P>SOLUTION: The light emitting device is provided with: a package having a recessed part, and including lead electrodes and a resin supporting the lead electrodes; and a light emitting element subjected to die bonding at the recessed part. The resin configuring the package includes particles which receives the light generated from the light emitting element to recover deterioration in the resin due to heat, and the wavelength of the light emitted by the light emitting element is selected within a wavelength range of 365 nm to 550 nm. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
