SEMICONDUCTOR MODULE, ITS MANUFACTURING METHOD AND SWITCHING POWER SUPPLY DEVICE

摘要

PROBLEM TO BE SOLVED: To evade the influence of a noise generated by the switching of a switching element on a control IC and to reduce the size and thickness of a switching power supply device. SOLUTION: In a semiconductor module, a rear electrode of a power semiconductor element 5 is connected and fixed to a conductor pattern 3 of an insulating substrate 4, and a wiring pattern 17 formed on a surface of a wiring board 8 opposite to the insulating substrate 4 is connected to an upper electrode of the power semiconductor element 5 through a conductive post 20. Consequently, the switching power supply device can be formed in a thin package. By providing an external lead-out terminal on the exposed surface of the printed board, the switching power supply device can be packaged on the surface of a substrate of electronic apparatus as a package size device and the size and thickness of a notebook type personal computer and a portable device or the like can be reduced. COPYRIGHT: (C)2004,JPO&NCIPI