发明名称 WIRING BOARD, ELECTRONIC EQUIPMENT, AND LED DISPLAY
摘要 PROBLEM TO BE SOLVED: To heat to raise the temperature of a desired electronic circuit component which needs to be heated when low in temperature up to within a recommended operation temperature range selectively in a short time with high heating efficiency. SOLUTION: A heating body 3 and a heat-sensitive switch means 4 are mounted on a substrate 1 on the surface where the electronic circuit component 2 is mounted. The heating body 3 is arranged in contact with a GND line 6 for the electronic circuit component 2 and efficiently heats the electronic circuit component 2 through the GND line 6 up to a specified operating temperature range. The heat-sensitive switch means 4 supplies electric power to the heating body 3 when the temperature in a heat insulating cover 5 falls below specified temperature to generate heat and cuts off the electric power to the heating body 3 when the temperature in the heat insulating cover 5 rises above the specified temperature to keep the electronic circuit component 2 within the desire recommended operating temperature range. The electronic circuit component 2 which needs to be heated, the heating body 3, and a heat switch 4 are covered with the heat insulating cover 5 and no heat is conducted to the circumference of the heat insulating cover 5 to improve the heating efficiency. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004226575(A) 申请公布日期 2004.08.12
申请号 JP20030012902 申请日期 2003.01.21
申请人 SHARP CORP 发明人 MIYATA MASATAKA
分类号 H05B3/00;G09F9/00;H05B3/10;(IPC1-7):G09F9/00 主分类号 H05B3/00
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