| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing composition obtainable from an epoxy resin composition good in storage property, curing property, and fluidity, an epoxy resin composition therewith, and a semiconductor device excellent in solder crack resistance and anti-humidity reliability. SOLUTION: This curing accelerator is mixed in a curing resin composition and promotes the curing reaction of the curing resin composition and represented by general formula (1) wherein R<SP>1</SP>, R<SP>2</SP>, and R<SP>3</SP>represent each independently a substituted or an unsubstituted aromatic group or a substituted or an unsubstituted alkyl group, Ar represents a divalent aromatic group substituted or unsubstituted with a substituent other than hydroxy group; Z<SP>1</SP>represents a group to be bonded to substituents R<SP>4</SP>and R<SP>5</SP>, Z<SP>2</SP>represents an organic group to be bonded to substituents R<SP>6</SP>and R<SP>7</SP>, R<SP>4</SP>and R<SP>5</SP>represent each independently a group formed when a monovalent proton donor substituent discharges a proton, and R<SP>6</SP>and R<SP>7</SP>represent each independently a group formed when a monovalent proton donor substituent discharges a proton. COPYRIGHT: (C)2004,JPO&NCIPI
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