发明名称 JIG AND METHOD FOR MOUNTING PIN, AND INSTALLING STRUCTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a jig and a method for mounting pins which are excellent in precision of the mounting positions of the pins by preventing tilting of the pins in a process of mounting the pins to a printed board. SOLUTION: As for the pin-mounting jig, a plurality of pin insertion holes 7 are formed in parallel to each other at a plate-like pin-mounting jig main body 5, and pin-holding parts 6 consisting of material which has a thermal expansion coefficient larger than that of the pin-mounting jig main body 5 and low Young's modulus are fitted into the pin insertion holes 7. First, solder balls 3 are mounted to pin supporting parts 8. Next, the shafts 4 of the pins are inserted to the pin-holding parts 6. After this, the printed board 1 is reversed, and the solder balls 3 mounted to the pins 4 and the position of a pad 2 formed at the printed board 1 are matched to be set to the pin-mounting jig. In the state, the pin-mounting jig is heated in the atmosphere of nitrogen in a reflow furnace to join the pads and pins via the solder balls. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228253(A) 申请公布日期 2004.08.12
申请号 JP20030012871 申请日期 2003.01.21
申请人 NEC CORP 发明人 FUKUDA KENJI
分类号 H01L23/12;H01L23/50;(IPC1-7):H01L23/12 主分类号 H01L23/12
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