| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a process for decreasing a leak current caused by an influence of defect in an implantation of a fluorine ion is required for a p-channel MOS transistor which suppresses diffusion of a boron ion to channel regions in a lateral direction by the fluorine ion to prevent an occurrence of a short channel effect. SOLUTION: A crystal defect caused by the implantation of a fluorine ion can be recovered to decrease the leak level of the p-channel MOS transistor and a fluctuation in the leak by the steps of implanting a fluorine ion for forming the fluorine ion implantation region, implanting ion for forming a p-tyep LDD6, and heat treating before forming side walls of gate electrodes 3, 23 at temperatures not less than 900°C. COPYRIGHT: (C)2004,JPO&NCIPI
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