| 摘要 |
PROBLEM TO BE SOLVED: To provide a boiling cooling device capable of cooling a heat generating body even when the heat generating body is mounted on the top-side surface of the device. SOLUTION: In this boiling cooling device, a plurality of intermediate plates 130A-130E are layered in between a top-side plate 110 and a bottom-side plate 120, and openings 131-134 are provided in the intermediate plates 130A-130E for the formation of a first space 140 which includes a coolant and a second space 150 which is adjacent to the first space 140 and lets through an external cooling fluid. Heat is exchanged between the coolant, which boils thanks to heat from a heat generating body 10 mounted on the outer surface of at least the bottom-side plate 120, and the external cooling fluid. In this evaporative cooling device, the upper part 150A of the second space 150 is formed to be adjacent to the inner surface of the top-side plate 110. COPYRIGHT: (C)2004,JPO&NCIPI
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