BAKE UNIT FOR SEMICONDUCTOR FABRICATING PROCESS

摘要

PURPOSE: A bake unit for a semiconductor fabricating process is provided to improve uniformity of a resist pattern CD(critical dimension) by heating the upper and lower surfaces of a wafer to a uniform temperature while using a dual plate in a PEB(post exposure bake) process for a photolithography process. CONSTITUTION: The wafer(2) is placed on a wafer plate. A heater inside the wafer plate is driven to indirectly heat the wafer so that a bake process is performed. The wafer plate includes a lower plate(210) for heating the lower surface of the wafer and an upper plate(220) for heating the upper surface of the wafer.