| 摘要 |
<p>Heat is transferred from an electronic device 100, eg a CPU, to a heat absorbing block 1, the heat absorbing block is cooled by a thermoelectric cooler 4 having a heat sink 53. Heat is also transferred from the block by heat pipe 2 to heat sink 3. The heat sinks are air-cooled by fan 200. A temperature sensor in direct contact with the electronic device may be used as part of a temperature control system for the device. More than one thermoelectric unit may be used to cool the device (figure 5) and forced fluid cooling may also be used (figures 9 and 10).</p> |
