| 发明名称 |
Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| 摘要 |
<p>A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25 DEG C or has a viscosity of not less than 400 Pa•s at 25 DEG C and of not more than 200 Pa•s at 80 DEG C; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition.</p> |
| 申请公布号 |
EP1184419(B1) |
申请公布日期 |
2004.08.11 |
| 申请号 |
EP20010119692 |
申请日期 |
2001.08.23 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
HARADA, TADAAKI |
| 分类号 |
C08G59/62;C08G59/18;C08L61/06;C08L63/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C08G59/42;C08G59/40;H01L23/00 |
主分类号 |
C08G59/62 |
| 代理机构 |
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代理人 |
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| 主权项 |
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