发明名称 |
PROCEDES ET SYSTEMES POUR MESURER LA MICRO-RUGOSITE D'UN SUBSTRAT COMBINANT DES MESURES DE COMPTEUR DE PARTICULES ET DE MICROSCOPE A FORCE ATOMIQUE |
摘要 |
Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface. |
申请公布号 |
FR2800514(B1) |
申请公布日期 |
2004.08.06 |
申请号 |
FR20000013932 |
申请日期 |
2000.10.30 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHO KYOO CHUL;HEO TAE YEOL;AN JEONG HOON;KIM GI JUNG |
分类号 |
G01B21/30;G01B7/34;G01B11/30;G01N15/08;G01N19/08;G01Q60/24;H01L21/66;(IPC1-7):H01L21/66;G01N13/16 |
主分类号 |
G01B21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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