| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of an optical module, to miniaturize it and to achieve high integration of it. SOLUTION: The optical module includes a substrate 32, a wiring pattern 34 formed on the substrate 32, a wiring board 30 having first and second parts 40 and 42 and an optical chip 10 having an electrode 24 and an optical part 12 and electrically connected to the wiring pattern 30 through the electrode 24. The first part 40 includes a translucent part 50. The optical chip 10 is mounted on the first part 40 so that the optical part 12 faces to the translucent part 50. The wiring board 30 is bent so that the second part 42 two-dimensionally overlaps the optical chip 10. COPYRIGHT: (C)2004,JPO&NCIPI
|
