发明名称 Miniaturized image sensor module
摘要 A miniaturized image sensor module of the invention includes a printed circuit board, an image sensor, a lens holder and a lens barrel. The circuit board has an upper surface, a lower surface and a slot. The image sensor has a first face and a second face, wherein the first face is formed with signal output terminals electrically connected to the lower surface of the circuit board so that the image sensor is positioned below the slot. The lens holder has a top face, a bottom face and a hole penetrating through the lens holder. The bottom face is fixed to the upper surface of the circuit board and is positioned above the slot. The lens barrel is contained in the hole and is formed with a chamber so that the image sensor may receive optical signals passing through the chamber, and transfer signals to the circuit board.
申请公布号 US2004150740(A1) 申请公布日期 2004.08.05
申请号 US20030356184 申请日期 2003.01.30
申请人 HSIN CHUNG HSIEN 发明人 HSIN CHUNG HSIEN
分类号 H04N5/225;(IPC1-7):H04N5/225 主分类号 H04N5/225
代理机构 代理人
主权项
地址