| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection method of an active matrix substrate capable of inspecting point defect, line defect, or brightness defect at the stage of the active matrix substrate. <P>SOLUTION: In the active matrix substrate, the subject of inspection has a plurality of picture elements 20 connected to each one of a plurality of signal lines 14, a plurality of scan lines 10, and a plurality of voltage supply lines 16 respectively, and each of the plurality of picture elements comprises a picture element selection transistor Q1 and an operation transistor Q2 that are connected to the signal line and the scan line, and in the operation transistor Q2, a gate G2 is connected to the picture element selection transistor Q1, and the voltage supply line is connected to the drain D2 and its source S2 is in open state. As for the inspection method, a potential is supplied from the inspection device and the parasitic capacitance Cdgo between the gate and the drain of the operation transistor Q2 is charged, and the charge stored in the parasitic capacitance Cdgo is discharged, and discharge current based on the parasitic capacitance Cdgo is measured by the inspection device, and thereby, based on the discharge current values, the defect of the plurality of picture elements 20 is judged by the inspection device. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
