| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inspection method capable of inspecting a presence or an absence of a bypass capacitor mounted between a power supply pattern and a grounding pattern on a substrate in a simple and reliable way without image processing by using less costly facilities. <P>SOLUTION: The packaged/non-packaged inspection method of the bypass capacitor includes a probe P1 connected to a signal generating source 30 and its output-terminal, and probes P2 and P3 which are connected to a voltage detecting means 40 and each voltage input-terminal of the voltage detecting means, and comprises the steps of: contacting the prove P1 and the prove P2 with each electrode terminal 22 and 23 of the bypass capacitor 20 in such a manner that the prove P3 is made a guide prove; generating a designated voltage from the signal generating source 30 in such a condition that the prove P3 is in contact with, for instance, a power supply pattern 13 at the side of a solder padding 11 in contact with the prove P2; and detecting a voltage V (packaged at V≠0, non-packaged at V=0) between the proves P2 an P3 by using the voltage detecting means 40. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
