| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit board that is highly dense, compact and small in thickness. <P>SOLUTION: The electronic circuit board 10 is provided with a plurality of small electronic circuit boards Pa an Pb having different electrical characteristics that are united on a fixing base 1, and a wiring layer such as a part mounting land 8 or the like is formed on the upper surface of their outermost layer. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
