发明名称 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method in which physical and thermal damages of a work are minimized, and losses of a material during the machining are reduced. <P>SOLUTION: The laser beam machining apparatus comprises a laser beam source 20, an ingot holding unit 12 to hold an ingot 10, a laser beam irradiation member 34 to irradiate laser beams from the laser beam source 20 on a portion to be machined of the ingot 10 held by the ingot holding unit 12, a motor 46 to relatively move the laser beam irradiation member 34 and the ingot 10, and a slider 38 to adjust the distance between the laser beam irradiation member 34 and the portion to be machined of the ingot 10. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004216406(A) 申请公布日期 2004.08.05
申请号 JP20030004972 申请日期 2003.01.10
申请人 EBARA CORP;DAINIPPON SCREEN MFG CO LTD 发明人 TATEISHI HIDEKI;FUKUNAGA YUKIO;NOMICHI SHINJI;TSUJIMURA MANABU;UEMURA HARUO;KONDO NORIYUKI
分类号 B23K26/00;B23K26/08;B23K26/40;(IPC1-7):B23K26/00 主分类号 B23K26/00
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