| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting method of an adhesive film for circuit connection capable of electrically connecting the circuit electrodes in a low temperature and in a short time and an adhesive film for circuit connection to be used for this. SOLUTION: This heat adhesive film is configured to electrically connect opposite circuit electrodes in a pressed direction by heating and pressing those circuit electrodes. This method for connecting the adhesive film for circuit connection is executed by setting the heating and pressurizing time when connecting those electrodes to three seconds or less under two stage connection conditions, that is, a primary condition that the heating and pressing time is two seconds or less in temperatures ranging from 120°C to 180°C, and a secondary condition that the heating and pressing time is one second or more in temperatures ranging from 180°C to 220°C. This adhesive film for circuit connection to be used for the above mentioned connecting method contains reactive resin to be hardened by heat, the heating start temperature in the differential scanning thermal analysis(DSC) of the adhesive film is set to 60°C or more, and a temperature in which the 60% of the hardening reaction ends is set to 160°C or less. COPYRIGHT: (C)2004,JPO&NCIPI
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