| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an electroformed product by which the electroformed product having high hardness can be produced while leaving fine pattern in the good state as it is. SOLUTION: A silver plating is applied on a silicon wafer to make a basic plate 1 (a). Then, on this, a resist 2 is coated (b). Successively, a pattern is baked on the resist 2 in a photo-lithographic process and the resist 2 is developed (c). Then, nickel plating is performed on this basic plate 1 to produce the electroformed product 3 (d). Successively, the electroformed product 3 is removed from the basic plate 1, and the resist stuck to the electroformed product 3 is carbonized by heating the electroformed product 3 and thereafter, the carbonized resist is removed with ultrasonic water washing (e). In this way, the electroformed product 3 having the fine pattern formed on the surface can be produced without damaging the pattern of the electroformed product 3 and also, causing the softening of the electroformed product 3. COPYRIGHT: (C)2004,JPO&NCIPI
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