| 发明名称 |
PROCESS FOR PRODUCING CIRCUIT BOARD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a high quality circuit board by stabilizing connection resistance of a double-sided circuit board and a multilayer substrate when a low compressibility prepreg sheet is employed. <P>SOLUTION: After metal foils are placed on the opposite sides of a compressive prepreg sheet having a conduction hole filled with conductive paste and then the prepreg sheet is compressed while sustaining a relatively low temperature condition, temperature is raised while sustaining the pressed state of the prepreg sheet, thus fusing and curing resin of the prepreg sheet. Consequently, the connection resistance is stabilized and a high quality circuit board is attained. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004221236(A) |
申请公布日期 |
2004.08.05 |
| 申请号 |
JP20030005676 |
申请日期 |
2003.01.14 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKENAKA TOSHIAKI;KAWAKITA YOSHIHIRO;TOJO TADASHI;TATSUMI KIYOHIDE |
| 分类号 |
B32B15/08;B29C43/20;B29K105/06;B29L9/00;B29L31/34;B32B37/10;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/00;B32B31/20 |
主分类号 |
B32B15/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
