Verfahren zur Flip-Chip-Montage von Halbleiterchips

摘要

The invention relates to the flip-chip mounting of semiconductor chips. In order to protect against mechanical stress or damage and to electrically insulate, a protective layer (7) is applied to the rear side of the semiconductor chip (2). This protective layer can also be provided on the flanks (8) of the semiconductor chip. The protective layer can be applied before starting the entire assembly process sequence or when the semiconductor is fixed upside down to a support (1).