METHOD FOR FORMING FLIP CHIP PACKAGE

摘要

PURPOSE: A method for forming a flip chip package is provided to reduce the thickness of package and to prevent rupture and short between bumps by using a groove. CONSTITUTION: A plurality of protrudent electrodes(31) as a pad are formed on a substrate(30). A block body(32) is deposited between the protrudent electrodes so as to form a groove between the electrode and the block body. The height of the block body is higher than that of the protrudent electrode. A solder cream(33) is filled in the groove. A bump(35) is then formed on the protrudent electrode.