发明名称 Heat sink device manufacture
摘要 A method for manufacturing a cooling device. The cooling device may be used to cool an integrated circuit. The method is broadly summarized by the following steps: pressing a metal slug to near-net shape, wherein the near-net shape includes a peripheral wall portion defining a chamber, the chamber having a first open end and a second closed end, the closed end defined by a chamber floor portion, and wherein the near-net shape includes a heat conductive base portion, the heat conductive base portion being defined by a lower base surface and the chamber floor portion; machining the lower base surface; creating a radius on the top of the peripheral wall portion; and cutting a plurality of slot openings in the peripheral wall portion.
申请公布号 US6769175(B2) 申请公布日期 2004.08.03
申请号 US20020060796 申请日期 2002.01.30
申请人 AGILENT TECHNOLOGIES, INC. 发明人 WAGNER GUY R
分类号 H01L23/367;H01L23/467;(IPC1-7):B23P15/00 主分类号 H01L23/367
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