发明名称 |
Thermal processing for three dimensional circuits |
摘要 |
An apparatus including a circuit of n circuit levels formed over a substrate from a first level to a nth level, wherein n is greater than one, and each of the n circuit levels has a material parameter change that is at least in part caused by a thermal processing operation that is applied to more than one of the n circuit levels simultaneously. An apparatus including a circuit of a plurality of circuit levels, each of the plurality of circuit levels having substantially similar material parameters.
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申请公布号 |
US6770939(B2) |
申请公布日期 |
2004.08.03 |
申请号 |
US20020256116 |
申请日期 |
2002.09.26 |
申请人 |
MATRIX SEMICONDUCTOR, INC. |
发明人 |
SUBRAMANIAN VIVEK;CLEEVES JAMES M.;KNALL N. JOHAN;LI CALVIN K.;VYVODA MICHAEL A. |
分类号 |
H01L27/06;(IPC1-7):H01L29/76 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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