| 摘要 |
THE FIRST PROCESS FOR PROCUCING A SEMICONDUCTOR DEVICE ACCORDING TO THE INVENTION COMPRISES THE STEPS OF :@PRIVIDING A WAFER OF GIVEN THICKNESS HAVING A SURFACE FURNISHED WITH SEMICONDUCTOR CIRCUITS AND A BACK;@FORMING GROOVES OF A CUT DEPTH SMELLER THAN THE THICKNESS OF THE WAFER,SAID GROOVES EXTENDING FROM THE WAFER CIRCUIT SURFACE;@STICKING A SURFACE PROTECTIVE SHEET ONTO THE WAFER CIRCUIT SURFACE ;@GRINDING THE BACK OF THE WAFER SO THAT THE THICKNESS OF THE WAFER IS REDUCED TO THEREBY FINALLY RESULT IN DIVISION OF THE WAFER INTO INDIVIDUAL CHIPS WITH SPACES THEREBETWEEN;@STICKINGA A PRESSURE SENSITIVE ADHESIVE SHEET FOR PICKUP STEP ONTO THE GROUND BACK OF THE WAFER, SAID PRESSURE SENSETIVE ADHESIVE SHEET FOR PICKUP STEP COMPRISING A BASE AND,SUPERIMPOSED THEREON, AN ENERGY RADIATIONCURABLE PRESSURE SENSITIVE ADHESIVE LAYER;@EXPOSING THE ENERGY RADIATION CURABLE PRESSURE SENSITIVE ADHESIVE TO AN ENERGY RADIATION;AND PEELING THE SURFACE PROTECTIVE SHEET FROM THE WAFER CIRCUIT SURFACE.THIS PROCESS IS ADVANTAGEOUS IN THAT CHIP ALIGNMENT IS EXCELLENT TO THEREBY ENABLE ENHANCING CHIP PICKUP EFFICIENCY.
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