发明名称 SMART CARD COATING CONTACT OF LOOP COIL WITH CONDUCTIVE PASTE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A smart card coating a contact of a loop coil contact with a conductive paste and a manufacturing method thereof are provided to enhance a combining force between the loop coil and the conductive paste, and automate a manufacturing process by coating the contacts formed to both ends of the loop coil with the conductive paste through a printing method. CONSTITUTION: A lower layer(50) is made of polymer and forms a lower part of the smart card. The loop coil(70) is attached to a loop coil inserting layer(60) and a spotfacing groove(61) is formed on the loop coil inserting layer. The spotfacing groove(81) is formed on an upper layer(80). The conductive paste contacts(90a,90b) are formed to the loop coil drawn out to the spotfacing groove of the upper layer. A chip base(30) is inserted into the spotfacing groove formed on the upper layer and includes the contacts(30a,30b) adhered to the conductive paste contacts by the conductive adhesives. A microchip(31) is electrically connected to the contacts of the chip base and is inserted into the spotfacing groove formed on the loop coil inserting layer by combining to the chip base.
申请公布号 KR20040067184(A) 申请公布日期 2004.07.30
申请号 KR20030004186 申请日期 2003.01.22
申请人 EC.TECHNOLOGY.CO., LTD.;YOO, IN JONG 发明人 CHAE, HYANG SEOK;KIM, JEONG SEOP;LEE, SE WON;LEE, UNG SEOK;YOO, IN JONG
分类号 G06K19/077;(IPC1-7):G06K19/077 主分类号 G06K19/077
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