发明名称 CURING METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a curing method and an apparatus for improved curing of a light curable sealing material for fixing two substrates which significantly suppress phenomenon of incomplete curing of the sealing material due to light blocking by a black matrix or metallization pattern. <P>SOLUTION: A method is disclosed for curing the light curable sealing material in an object. The object has a first substrate and a second substrate which face each other. The light curable sealing material is used to mount the first substrate and second substrate. The method includes an irradiation process (a) and an irradiation process (b). In the irradiation process (a), a body is irradiated with light which is made incident from the first substrate and irradiates the body and the light reaches the light curable sealing material. In the irradiation process (b), the body is irradiated with light which is made incident from the second substrate and irradiates the body and the light reaches the light curable sealing material. A curing device is provided for implementing said method. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004213009(A) 申请公布日期 2004.07.29
申请号 JP20030435696 申请日期 2003.12.26
申请人 CHI MEI ELECTRONICS CORP 发明人 PAN CHENG CHE;PARK SUNG SOO
分类号 G02F1/1335;G02F1/1339;G02F1/1345;G09F9/00;H04N5/66 主分类号 G02F1/1335
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