RECESSED MICROSTRUCTURE DEVICE AND FABRICATION METHOD THEREOF
摘要
The present invention provides a micro-electro-mechanical device with a recessed micromechanical structure and to a method of fabrication thereof. The present invention also provides silicon wafers provided with recessed micromechanical structures, which are useful in the field of micro-electro-mechanical systems. The present invention also provides a method for fabrication of micro-electro-mechanical device using micromachining techniques.
申请公布号
WO2004063089(A2)
申请公布日期
2004.07.29
申请号
WO2004IN00005
申请日期
2004.01.05
申请人
INDIAN INSTITUTE OF TECHNOLOGY - DELHI (IIT);PAL, PREM;CHANDRA, SUDHIR;TULI, SUNEET