| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable multilayer wiring board which can securely connect layers. SOLUTION: The board is provided with a conductor layer and an insulating layer which is brought into contact with at least a part of the conductor layer. The board is provided with a conductor post which passes through the insulating layer, and is projected from the surface of the insulating layer on a face opposite to the conductor layer. The conductor post of the wiring board having a solder layer formed on the surface of the tip of the conductor post and is mainly composed of tin and a gold coating face of a layer to be connected, which has an interlayer connection land composed of a copper layer, a diffusion preventing metal layer and a gold coat in this order are thermally pressurized through an adhesive layer so as to be bonded with one another by soldering. COPYRIGHT: (C)2004,JPO&NCIPI |
