发明名称 |
SEPARATING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SEPARATING METHOD |
摘要 |
<p>A separating method, characterized in that in a separating step, the exfoliation of a first adhesive agent and the curing of a second adhesive agent are effected at the same time, to thereby simplify the process for manufacturing a display device, in that it provides an advantageous timing for transferring a layer to be separated having an electrode of a semiconductor element formed therein to a predetermined substrate, and in that particularly when the separation is carried out in the state that a plurality of semiconductors have been formed on a large size substrate, the separation is practiced through the adsorption of the substrate by the utilization of pressure difference. The method allows the simplification of a separating step and also allows the uniform separation and transfer to a substrate even when a large size substrate is employed.</p> |
申请公布号 |
WO2004064018(A1) |
申请公布日期 |
2004.07.29 |
申请号 |
WO2003JP16540 |
申请日期 |
2003.12.24 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI, SHUNPEI;TAKAYAMA, TORU;MARUYAMA, JUNYA;GOTO, YUUGO;OHNO, YUMIKO |
分类号 |
G02F1/136;G02F1/1368;G09F9/30;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L29/786;H05B33/14;(IPC1-7):G09F9/30 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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