发明名称 |
METHOD FOR ELECTROLESS PLATING |
摘要 |
<p>A method for carrying out an electroless plating onto a polymer electrolyte, characterized in that it comprises a swelling step as a pre-treatment step of swelling the polymer electrolyte with a good solvent or a mixed solvent containing a good solvent, and the resultant swollen polymer electrolyte has a specific shape and a thickness 110% or more that of the polymer electrolyte in a dry state. The method allows the preparation of a laminate comprising a metal layer and a polymer electrolyte layer which can be used in an application field requiring a bending greater than that in a conventional field.</p> |
申请公布号 |
AU2003296142(A1) |
申请公布日期 |
2004.07.29 |
申请号 |
AU20030296142 |
申请日期 |
2003.12.26 |
申请人 |
EAMEX CORPORATION |
发明人 |
MINORU SUGIYAMA;SUSUMU HARA |
分类号 |
C23C18/20;H02N2/12;(IPC1-7):C23C18/20;F03G7/00;C23C18/31 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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