MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To surely realize enhancement in wiring flexibility, formation accuracy of a conductor pattern and connection reliability due to improvement in the resistance to a roughening solution. SOLUTION: A plated through hole 5 is filled with a copper paste 7 of a conductive material. A plating film 8 acting as a metal film is formed on an exposed surface of the copper paste 7. An insulating layer 9 having an opening 19 is formed at a position where the plating film 8 is to be exposed on a substrate 2. The insulating layer 9 is chemically roughened. The opening 19 is electrolessly plated. COPYRIGHT: (C)2004,JPO&NCIPI