IC CHIP PROVIDED WITH BARRIER STRUCTURE, AND DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain improved crack stopping and contaminant barriers for an IC chip. SOLUTION: On-chip overlapped crack end barrier structure is constituted. A conductive material in barrier structure design is used for forming the depth of several conductive layers, by wiring each barrier to a contact pad and a device pin and connecting a monitoring device to a chip. Upper surface deposit, consisting of a material such as polyimide, suppresses peeling off of layers. Other barriers may include structural characteristics for completely shielding moisture absorption and oxidation, as compared with typical crack stopping structure. Thereto, other barriers are constituted so as to give crack stop protection, to be electrically connected to a monitoring device and so as to test the capacitance/resistance of the barrier structure to show the complete states of the barriers to a user. A barrier destroyed by cracks or humidity absorption/oxidation shows deviation in the capacitance/resistance. COPYRIGHT: (C)2004,JPO&NCIPI