| 摘要 |
Conductive bodies are provided in an array with a comb or honeycomb structure on an insulating substrate and may be controlled by a conductor track system on or in the substrate. The system includes contact bumps on the substrate and is connected to an external or implanted drive. The substrate is mfd. from a polymer or silicone rubber and/or other body-compatible substrate and the conductive bodies comprise filaments of flexible, body-compatible material or metal wires of Ag, Au, Pt, Ir sheathed in a polymer. |
