| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device together with its manufacturing method that is superior in heat radiation, light emitting efficiency and service life without degrading the workability of a lead frame and the reliability of an LED chip in the semiconductor light emitting device using a light emitting diode or the like. <P>SOLUTION: The semiconductor light emitting device is provided with an LED chip 4, a first lead frame 1 to which the LED chip 4 is mounted, a second lead frame 2 that is electrically connected with the LED chip 4 by means of a bonding wire 5, and a resin 3 that surrounds the LED chip 4 and fixes the first and second lead frames 1 and 2. It is also provided with a metallic body 8 as a thermal conductor under the first lead frame 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
