| 摘要 |
PROBLEM TO BE SOLVED: To provide a test board for an integrated circuit capable of reducing the labor for development, characteristic test or the like, and reducing the cost. SOLUTION: This board used for conducting between an IC and a corresponding portion of a tester is equipped with a first pad region 28 formed on one face of an insulating substrate 22, a plurality of first pads 27 provided on the first pad region 28 so that a potion of the IC formed on a wafer becomes conductible, a second pad region 31 formed on the other face of the substrate 22, a plurality of second pads 30 provided on the second pad region 31 so as to be conductible to the first pad 27 corresponding thereto and provided so that the corresponding portion of the tester becomes conductible, a socket region 23 provided on the substrate 22, and a plurality of receiving terminals 25 provided on the socket region 23 so as to be conductible to the first pad 27 corresponding thereto and provided so that a socket 24 for mounting the IC where a package is formed can be mounted thereon. COPYRIGHT: (C)2004,JPO&NCIPI
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