| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a bonded glass substrate microchip with a high throughput, in a short period of time, and further in a high yield without the need of using the conventional high grade surface cleaning means. SOLUTION: In a method for manufacturing the glass substrate microchip, comprising joining two sheets of glass substrates (A), (B), wherein fine flow passages (C) are formed in a groove-like shape in the surface part of at least one glass substrate (A), the glass substrates (A), (B) are adhered and joined by pressurizing the glass substrates (A), (B) with a press (D) at a temperature of not higher than the softening point of the substrates (A), (B) under a reduced pressure environment having a low degree of vacuum of≥10<SP>-4</SP>Torr. COPYRIGHT: (C)2004,JPO&NCIPI
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