| 摘要 |
The invention relates to contact engineering in signal connections in the substrate of an ultra-high frequency module, especially a microwave or millimetre wave module. The ultra-high frequency module contains a) a multi-layered substrate comprising at least two dielectric layers and metallization planes and through contacts, and b) chips arranged on the upper side of the multi-layered substrate. The chips are electrically connected to each other and are connected to the structures on the metallization planes by means of HF connections. The HF connection is established by means of at least two strip conductors having a fan-shaped structure. The invention makes it possible to contact chips in an easy manner with small distances between the outer contacts on the multi-layered substrate. . |
