| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor device excellent in heat dissipation and has no warping. <P>SOLUTION: A wiring pattern 23 is formed, which is electrically connected to opposite surfaces of a resin base member 16 via a conductor section 22, and a metal semiconductor chip mounting section 24 is formed on the one surface side of the resin base member 16. A through-hole 17 is formed in a portion of the resin base member 16 corresponding to the semiconductor chip mounting section 24. A metal heat transfer section 14 connected to the semiconductor chip mounting section 24 is fitted into the through-hole 17, and a metal heat dissipation section 25 connected to the heat transfer section 14 is formed on the other surface of the resin base member 16. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
