| 摘要 |
A wiring board module has two wiring boards placed on an external circuit board. In each wiring board, a terminal end of a laminated waveguide tube is exposed at a lateral side of a dielectric substrate, thus forming an exposed face, and the dielectric substrate is provided at the bottom thereof in the vicinity of the exposed face with connection pads to be used for mounting the wiring board on the surface of the external circuit board. The exposed faces of the laminated waveguide tubes of the two wiring boards are contacted with each other, and the connection pads at the bottoms of the wiring boards are connected and fixed to connection pads disposed on the surface of the external circuit board.
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