发明名称 |
Microelectromechanical system device packaging method |
摘要 |
A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.
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申请公布号 |
US6767764(B2) |
申请公布日期 |
2004.07.27 |
申请号 |
US20020167546 |
申请日期 |
2002.06.12 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
SAIA RICHARD JOSEPH;DUROCHER KEVIN MATTHEW;KAPUSTA CHRISTOPHER JAMES;NIELSEN MATTHEW CHRISTIAN |
分类号 |
B81B7/00;(IPC1-7):H01L21/44;H01L21/476 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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