发明名称 COOLING SYSTEM FOR SEMICONDUCTOR FABRICATION EQUIPMENT HAVING IMPROVED INSTALLATION POSITION OF FLOW SENSOR
摘要 PURPOSE: A cooling system for semiconductor fabrication equipment having an improved installation position of a flow sensor is provided to prevent a malfunction due to a contact between a flow sensor and a main frame by controlling a gap between the flow sensor and the main frame. CONSTITUTION: A cooling system for semiconductor fabrication equipment having an improved installation position of a flow sensor includes a process chamber, a cooling water inlet tube, a cooling water outlet tube, a flow sensor, and a main frame. The cooling water inlet tube and the cooling water outlet tube are used for circulating cooling water to maintain constantly the temperature of the process chamber. The flow sensor(7') is installed between the cooling water inlet tube and the cooling water outlet tube in order to measure the flow of the cooling water. The main frame(15') is used for covering an upper side of the flow sensor. A gap between the flow sensor and the main frame is sufficiently maintained by installing the flow sensor at a lower side of the main frame.
申请公布号 KR20040065898(A) 申请公布日期 2004.07.23
申请号 KR20030003098 申请日期 2003.01.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, SANG JIN
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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