发明名称 COMPOSITE MATERIAL AND WORKING METHOD USING THIS MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a grinding material and a polishing material, or a grinding method and a polishing method for obtaining a base board having no flaw and a polishing trace by improving polishing accuracy of surfaces of the base board, an interlayer insulating film, a circuit pattern, etc. SOLUTION: A polishing composite material includes carbon fiber of a multilayer structure having an outer diameter of 2 to 500 nm, having the aspect ratio of 5 to 15,000 and having a hollow structure in a central part, an abrasive grain and a base material. This carbon fiber is desirably set to a 4m<SP>2</SP>/g or more BET specific surface area, 0.345 nm or less spacing (d002) of a carbon (002) surface in X-ray diffraction, and 1.5 or less ratio (Id/Ig) of a 1,341 to 1,349 cm<SP>-1</SP>peak height (Id) of a band in a Raman scattering spectrum to a 1,570 to 1,578 cm<SP>-1</SP>peak height (Ig) of the band. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004202681(A) 申请公布日期 2004.07.22
申请号 JP20030413359 申请日期 2003.12.11
申请人 SHOWA DENKO KK 发明人 KASHIMA SHINJI;YAMAMOTO TATSUYUKI;TOKI MASAHARU;MORITA TOSHIO
分类号 B24D3/02;B24D3/00;B24D3/06;B24D3/14;B24D3/28;B24D11/00;(IPC1-7):B24D3/02 主分类号 B24D3/02
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