| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an insulation sheet and an insulation sheet having a metal foil, which are excellent in packaging property for a semiconductor chip when being used for a multi-layer printed wiring board, and also, to provide the multi-layer printed wiring board which is excellent in packaging property for the semiconductor chip. <P>SOLUTION: This insulation sheet is constituted of a resin composition containing a hardenable resin and an inorganic filler, and the elasticity at 250°C of the insulation sheet is 100 (MPa) or higher. For this insulation sheet having the metal foil, the insulation sheet and the metal foil are laminated. For this multi-layer printing wiring board, the insulation sheet is used. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
