| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern wiring board or a device substrate of high quality. SOLUTION: In a droplet jetting device, a jetting head 11 jets and gives a plurality of droplets of a solution including particulates to a substrate 14, a pattern is formed in a conduction region on the substrate 14 and a volatile component of the droplets after they are given is volatilized so as to form pattern wiring or the device. When a size of the particulate is set to be Dp and a discharge port diameter to be Do, they are set to be 0.0001≤Dp/Do≤0.01. The jetting head 11 jets the solution with growing operation force of film boiling bubbles generated in the solution in an instant. A shape of the solution when it flies is made in a long columnar one extending in a flying direction and is set to be five times as much as the diameter. Relative moving speed of the substrate 14 and the jetting head 11 is set to be not more than 1/3 of jetting speed of the solution. A discharge port is formed in the substrate formed of a material harder than the particulates in the solution including the particulates. COPYRIGHT: (C)2004,JPO&NCIPI
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