发明名称 Packaging material for electronic-part case, and others
摘要 The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.
申请公布号 US2004142190(A1) 申请公布日期 2004.07.22
申请号 US20030398653 申请日期 2003.10.07
申请人 KAWAI HIDEO;TANAKA KATSUMI;AOYAMA TAKAHIRO;NAKAZAKI MITSUO 发明人 KAWAI HIDEO;TANAKA KATSUMI;AOYAMA TAKAHIRO;NAKAZAKI MITSUO
分类号 B32B27/06;B32B15/08;B32B15/082;B32B15/20;H01G9/08;H01M2/02;H01M2/10;H01M10/40;(IPC1-7):B32B15/08;H01G2/10 主分类号 B32B27/06
代理机构 代理人
主权项
地址