| 摘要 |
PROBLEM TO BE SOLVED: To firmly attach a shield cover to a multilayer circuit substrate to certainly shield an electromagnetic wave from the outside, and to enhance the productivity. SOLUTION: Electronic part elements 3 are mounted on a multilayer circuit substrate 1 in which a plurality of insulated layers 1a to 1d are laminated and a circuit interconnection is formed between the insulated layers, and also a shield cover 2 made of metal having a side wall in its outer peripheral part is mounted to coat these elements. A plurality of notches 4 are formed in at least an uppermost layer out of the insulated layers 1a to 1d, and a stationary leg 2b and a joining leg 2c are formed in a side wall 2a of the shield cover 2. In the stationary leg 2b, its lower end is located in a formation region of the notch 4, the joining leg 2c is folded inwardly of the side wall 2a, and at least a part thereof is disposed corresponding to a ground electrode pad 5. The stationary leg 2b is secured to the multilayer circuit substrate 1 in the formation region of the notch 4 through a resin material 7, and also the joining leg 2c is electrically connected to the ground electrode pad 5 through conductive adhesives 6. COPYRIGHT: (C)2004,JPO&NCIPI
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